GEC-CHIP

Hangzhou Dixin Technology Co., Ltd. was established in 2018, headquartered in the Artificial Intelligence Town of Hangzhou, China, and has branch offices in Shanghai and Shenzhen. The company's research and development direction includes high-end 5G wireless communication chips, low-power and high-performance IoT chips, high-end industrial electronic analog RF chips, and wireless communication modules, spanning multiple types of chips such as signal chains, monitoring chains, and clock chains. The terminal application scenarios cover various fields such as wireless communication, consumer electronics, industrial control, and medical devices.

More than 80% of the core R&D team members of the company have master's and doctoral degrees, with 10 to 20 years of experience in chip R&D and mass production. They have worked in semiconductor companies such as Qualcomm, MediaTek, Samsung, and TI, and graduated from prestigious universities at home and abroad such as Tsinghua University, Zhejiang University, University of California, Los Angeles, and National University of Singapore. They cover technical talents in systems, RF, analog, digital, algorithms, software, testing, applications, and layout, and have complete capabilities in chip R&D and mass production.

As a national high-tech enterprise, a technology-based small and medium-sized enterprise in Zhejiang Province, a Hangzhou Eagle Plan enterprise, and a research and development center in Yuhang District, Hangzhou, Dixin Technology is committed to becoming a leading designer of high-end analog RF chips for 5G wireless communication, IoT, and industrial electronics worldwide.