Yachuang Electronics Group's subsidiary, Shanghai Analog Semiconductor Technology Co., Ltd. (hereinafter referred to as "Analog Semiconductor" or "Analog"), announces the mass production of its new second-generation high-side switch chip HD80152 and SPI high-side chip HD708204. Since the launch of Analog's first-generation high-side switch chips, the HD7XXX series, in 2023, this product series has been shipped in large volumes to renowned Tier 1 suppliers and automotive manufacturers both domestically and internationally. The cumulative shipments of the high-side switch product series have approached 20 million units, with a PPM quality performance of less than 0.05. The mass production of these second-generation high-side and SPI high-side products will solidify Analog's continuous technological leadership in the high-side product category and better support the sustained growth demands of the domestic new energy vehicle market.

01 HD8XXX Second-Generation High-Side: Performance and Functional Upgrades

·       Given the complexity of application scenarios for high-side switch products, safety and reliability remain the foremost priority. Withstanding 1 million cycles of high-temperature short-circuit testing is the minimum threshold for long-term reliability. While ensuring high reliability, the second-generation high-side achieves higher on-chip integration, enhanced halogen lamp load capacity, stronger EAS capability, improved EMC anti-interference performance, higher current sampling accuracy, and a more comprehensive product coverage ranging from 1.2mΩ to 120mΩ.

·       Leveraging the rapid volume growth and high reliability demonstrated by the first-generation HD7XXX high-side products, coupled with the multi-faceted performance upgrades of the second-generation products, Analog's new offerings have quickly gained substantial trust from major domestic and international customers. The HD80152, a two-channel 12mΩ high-side switch, will be integrated into a European top-tier Global Tier 1's domain control platform project, with SOP scheduled for Q1 2026. The HD8004, a single-channel 4.2mΩ high-side switch, will be adopted by a leading domestic new energy vehicle manufacturer for its 4.0 domain control platform, with SOP in Q2 2026. The HD80082, a two-channel 9.3mΩ high-side switch, will be utilized in the next-generation domain control platform of a prominent domestic automaker, targeting SOP in Q2 2026.

02 High-Side Technology Path: SPI High-Side

·       With the continuous increase in the number of high-side products per vehicle in the new energy sector, coupled with the growing demand for functional safety and configuration flexibility, traditional I/O-type high-side switches can no longer meet new application requirements. Controlling high-side switches via an SPI interface enables the management of more channels, integrates the driving of components with similar load capacities, incorporates I²T algorithms to potentially reduce wiring harness costs, and offers diagnostic and self-recovery capabilities for functional safety. This better suits the design of safe, intelligent domain control platforms. Analog Semiconductor's HD708204, an SPI high-side product integrating two 6.4mΩ channels and two 20mΩ channels, has entered mass production and has been designated for use in a new energy vehicle's domain control platform, with the terminal model scheduled for SOP in Q3 2026. Furthermore, a second-generation six-channel SPI high-side product will be sampled in Q2 2026, providing more options for domestically produced safe and intelligent domain control. While I/O ports can be expanded to continue using I/O-type high-side switches, this increases system complexity. Simplicity equates to reliability; in the long run, SPI high-side offers advantages in cost and control safety.

03 Intelligent High/Low-Side Product Platform

·       Currently, Analog Semiconductor has established a comprehensive product portfolio including the traditional 12V I/O high-side product line, the eFuse product line, the 24V/48V high-side product line, the SPI high-side product line, and the low-side product line. The company strives to consistently remain the preferred and reliable brand for domestic intelligent high-side and low-side products.

·       12V I/O High-Side Product Line: The first-generation HD7XXX high-side products are in stable mass production with reliable supply. The second-generation HD8XXX products will be fully launched in phases from Q4 2025 to Q2 2026. Particularly for the 1.2mΩ-2mΩ products, through collaborative breakthroughs in process, design, and packaging, the EAS capability exceeds that of European competitors, completing the final piece of the domestic substitution puzzle. The third-generation HD9XXX products will be sampled in Q1 2026, rapidly closing the technological gap with European competitors with a new generation launched every two years.

·       SPI High-Side: The first four-channel SPI high-side chip is already in mass production. The second-generation six-channel SPI high-side chip will be sampled in Q2 2026.

·       eFuse Product Line: Single-channel eFuse pre-driver products are in mass production. Dual-channel products will be sampled in 2026. eFuse products with integrated MOSFETs directly target the next-generation offerings of the industry's top players.

·       24V High-Side and 48V High-Side: Full-category sampling will be progressively achieved from Q1 to Q2 2026.

·       Low-Side Products: 4-channel and 8-channel low-side switches have been sampled. Single-channel low-side switches will be sampled in Q2 2026.

04 Proactive and Sufficient Capacity Preparation

·       Due to the current development in artificial intelligence, industry chain capacity is tightening. Analog Semiconductor has been proactively increasing and expediting wafer procurement since mid-2025. Additionally, the company has collaborated in advance with packaging and testing partners to establish sufficient production capacity for high-side products, ensuring stable and sustainable delivery to meet end-customer demands.

About E-Mantech

SHENZHEN E-MANTECH CO., LIMITED was established in 2014 with a registered capital of 10 million RMB.
Its predecessor was Shenzhen Hainengda Technology Development Co., Ltd., founded in 2005.
The company is committed to becoming the preferred trading platform for electronic components in the Chinese electronics industry.
Currently, it is a first level agent for Murata in Japan, an AVX agent, a Philips power agent, a KEC agent, a Prisemi agent for Xindao, a BPS agent for Jingfeng Mingyuan, a GPI agent for New Century,
a TELINK agent for Tailing, an SGX agent, and a WE smart agent. Our products cover fields such as communication, automotive, industrial control, medical, home appliances, lighting, power supply,
security, new energy, and consumer electronics; Our business covers regions such as Hong Kong, South China, East China, North China, Central China, and Southwest China.

Contact phone number: 0755-88352448 88352450

Official website: www.himantech.com

Official account: E-Mantech

QQ：800004227

Email: service@hi-mantech.com

Address: Room 1601, Block A, Coolpad Building, Intersection of Baoshen Road and Keyuan North Road, Xili Street, Nanshan District, Shenzhen