New Product | Murata's First Hollow-Structure Low Transmission Loss LCP Flexible Substrate

Murata Manufacturing Co., Ltd. has, for the first time*, commercialized and begun mass production of the "ULTICIRC" LCP (liquid crystal polymer) flexible substrate featuring a hollow structure. This product achieves a dielectric constant (Dk) of less than 2.0 and significantly reduces transmission loss by incorporating a unique hollow structure inside the substrate. With its combination of thinness and very low transmission loss, this new product can contribute to the development of high-speed, large-capacity communications in high-frequency ranges such as 6G. (*According to a Murata survey as of December 9, 2025.)

Main Specifications

First LCP flexible substrate to adopt a hollow structure, achieving a dielectric constant (Dk) of less than 2.0

Combines thinness with very low transmission loss, contributing to high-speed, large-capacity communications in high-frequency ranges

Utilizes a proprietary adhesive-free process and highly hermetic LCP, maintaining excellent moisture resistance even with the hollow structure

In the future, 6G is expected to use the FR3 band. FR3 (Frequency Range 3) is the frequency range anticipated for 6G, defined as approximately 7 GHz to 24 GHz. To achieve high-speed, large-capacity communication in such high-frequency ranges, substrates with very low transmission loss are required.

Furthermore, in response to the demand for miniaturization of smartphones and communication equipment, the need for thin, flexible substrates that can be formed into flexible shapes and are suitable for space-saving designs is expected to grow. Murata has previously offered LCP flexible substrates with good high-frequency characteristics. To address the further demands and challenges posed by future 6G, the company has developed and commercialized this product.

Conventionally, reducing the thickness of a flexible substrate leads to increased transmission loss. In response, this product incorporates an air layer inside the substrate (see diagram below), achieving a dielectric constant lower than 2.0—lower than that of Murata's conventional products—thereby combining thinness with very low transmission loss.

Schematic cross-section of the "ULTICIRC" flexible substrate

About E-Mantech

SHENZHEN E-MANTECH CO., LIMITED was established in 2014 with a registered capital of 10 million RMB.

Its predecessor was Shenzhen Hainengda Technology Development Co., Ltd., founded in 2005.

The company is committed to becoming the preferred trading platform for electronic components in the Chinese electronics industry.

Currently, it is a first level agent for Murata in Japan, an AVX agent, a Philips power agent, a KEC agent, a Prisemi agent for Xindao, a BPS agent for Jingfeng Mingyuan, a GPI agent for New Century, a TELINK agent for Tailing, an SGX agent, and a WE smart agent. Our products cover fields such as communication, automotive, industrial control, medical, home appliances, lighting, power supply, security, new energy, and consumer electronics; Our business covers regions such as Hong Kong, South China, East China, North China, Central China, and Southwest China.

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